期刊
JOURNAL OF ELECTRONIC MATERIALS
卷 38, 期 5, 页码 691-699出版社
SPRINGER
DOI: 10.1007/s11664-008-0636-8
关键词
Anodic dissolution; electrochemical migration; eutectic Sn-Pb solder; NaCl; Na2SO4
资金
- Ministry of Knowledge Economy
- Korea Science and Engineering Foundation
- Korea Evaluation Institute of Industrial Technology (KEIT) [10029790] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
Anodic dissolution and the electrochemical migration characteristics of eutectic Sn-Pb solder alloy in deaerated 0.001% NaCl and Na2SO4 solutions were investigated using anodic polarization and water drop tests. Anodic polarization results revealed that a Pb-rich phase was preferentially ionized in deaerated 0.001% NaCl solution and an Sn-rich phase was predominantly ionized in deaerated 0.001% Na2SO4 solution, which coincides well with the composition of the dendrites formed during water drop tests. X-ray diffraction and photoelectron spectroscopy results showed that the surface oxide film formed on pure Sn in deaerated 0.001% NaCl solution is more stable than that formed on pure Sn in deaerated 0.001% Na2SO4 solution. The surface oxide film formed on pure Pb in deaerated 0.001% Na2SO4 solution is more stable than that formed on pure Sn in deaerated 0.001% NaCl solution. Therefore, the quality of the surface film of eutectic Sn-Pb solder in a chemical environment seems to be critical not only for corrosion resistance, but also for electrochemical migration resistance.
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