Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints

标题
Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints
作者
关键词
-
出版物
JOURNAL OF APPLIED PHYSICS
Volume 111, Issue 4, Pages 043705
出版商
AIP Publishing
发表日期
2012-02-23
DOI
10.1063/1.3682484

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