Article
Chemistry, Multidisciplinary
Fei Zhang, Yuxuan Sun, Lei Guo, Yinhang Zhang, Dan Liu, Wei Feng, Xi Shen, Qingbin Zheng
Summary: This study reports a method to produce graphitic structure welded carbon nanotube networks by interfacial welding, which significantly reduces the thermal resistance between the carbon nanotubes and improves the thermal conductivity of the nanocomposite. The nanocomposite with a 4.75wt% loading of graphitic structure welding exhibits a 410% enhancement in thermal conductivity, reaching 5.58 W m-1 K-1. Molecular dynamics simulations reveal the effect of graphitic structure welding on heat transfer behavior, providing insights for optimizing thermal transport performance in next-generation microelectronic devices.
ADVANCED FUNCTIONAL MATERIALS
(2023)
Article
Materials Science, Composites
Hanying Zou, Yanhui Feng, Xiaolong Tang, Xinxin Zhang, Lin Qiu
Summary: The excellent properties of carbon nanotubes allow for high thermal and electrical conductivity, but the weak coupling between them leads to performance below expectations. This study introduces polypyrrole (PPy) to improve both electrical and thermal conductivity of carbon nanotube-based materials, providing new design ideas for advanced electronic devices.
COMPOSITES SCIENCE AND TECHNOLOGY
(2024)
Article
Chemistry, Physical
Hamidreza Zobeiri, Nicholas Hunter, Nathan Van Velson, Cheng Deng, Qianying Zhang, Xinwei Wang
Summary: 2D materials experience strong thermal non-equilibrium between optical and acoustic phonon branches under intense laser irradiation, impacting the characterization of interface thermal resistance. It is important to consider this non-equilibrium effect when evaluating interfacial thermal properties of materials like MoS2 supported on quartz.
Article
Metallurgy & Metallurgical Engineering
Rong-yue Wang, Zhang-fu Yuan, Hong-xin Zhao, Xiao Yang, Yu-hui Hao
Summary: The effect of Sb element on the welding reliability of Sn-Sb alloy solder was investigated by studying the interfacial behavior of Sn-Sb alloys with different Sb contents on Cu substrate. The evolution process of interfacial layers was explained through analysis of microstructure and interfacial reaction thermodynamics of Sn-xSb/Cu system. The addition of Sb has a non-monotonic effect on the intermetallic compound layers. Sb inhibits the diffusion of Cu into solder. The addition of 3 wt.% Sb in the alloy reduces the activation energy of interfacial reaction from 286.41 to 62 kJ/mol, promoting the interfacial reaction. The addition of 10 wt.% Sb increases the activation energy of interfacial reaction to 686.73 kJ/mol, inhibiting the interfacial reaction and reducing the erosion of Cu substrate by the solder, and inhibiting the formation of an excessively thick interfacial layer.
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
(2023)
Article
Materials Science, Multidisciplinary
Shuai Wang, Jiayun Feng, Shang Wang, Kaifeng Wang, Muying Yu, Yanhong Tian
Summary: In this study, a novel high entropy alloy SnPbInBiSb with a low melting point was fabricated and investigated for its potential as a new solder material in low-temperature electronic packaging. The interfacial reaction between SnPbInBiSb and Cu was also studied, revealing that the alloy's sluggish diffusion effect and lattice distortion effect hindered the growth of intermetallic compounds.
Article
Construction & Building Technology
Bozhong Lin, Hu Fang, Yao Yao
Summary: This study investigates the bonding performance between different functionalized carbon nanotube repair mortar and old mortar substrate exposed to high temperature. The results show that the surface roughness of the old mortar can gradually increase with increasing temperature, improving the interfacial mechanical interlocking. The functionalized carbon nanotube reduces the content and orientation of calcium hydroxide and improves the microhardness of the interfacial transition zone. A bonding strength prediction model considering porosity and the reinforcing effects of different functionalized carbon nanotube is proposed. The findings of this study can contribute to further research and application of nanomaterials in the field of structural repair and maintenance.
CONSTRUCTION AND BUILDING MATERIALS
(2023)
Article
Chemistry, Physical
Pengyan Mao, Jixiang Qiao, Yang Zhao, Song Jiang, Kan Cui, Jianhang Qiu, Kaiping Tai, Jun Tan, Chang Liu
Summary: Nanograined materials exhibit excellent properties due to their grain size effect, but often suffer from poor thermal stability. A bottom-up assembly strategy was used to create a hybrid of Cu nanograins and carbon nanotubes with enhanced thermal stability. The application of compressive hoop stress effectively inhibits grain morphology change, leading to a significantly increased volume fraction of interfaces and grain boundaries.
Article
Materials Science, Multidisciplinary
Georgios Konstantopoulos, Panagiotis Maroulas, Dimitrios A. Dragatogiannis, Stefanos Koutsoumpis, Apostolos Kyritsis, Costas A. Charitidis
Summary: Thermoplastic nanocomposites were developed to provide suitable materials for thermal management devices through the addition of Carbon Nanotubes (CNTs) in polyethylene, demonstrating good thermal conductivity and ease of handling. Characterization of CNTs morphology and thermal properties established an interconnected network that enhanced heat transfer, showing potential for significant improvements in thermal conductivity.
MATERIALS & DESIGN
(2021)
Article
Thermodynamics
Jiao Chen, Baoyi Hu, Zhaoliang Wang
Summary: In this manuscript, the thermal transport properties of the SWCNT/Si interface were investigated using the Non-equilibrium Molecular Dynamics approach. The results showed that the low-frequency acoustic branch of SWCNT was suppressed by phonon scattering from the substrate, and the interfacial thermal conductance gradually stabilized with increasing temperature. The findings contribute to the understanding of interface phonon modes and provide theoretical support for efficient chip cooling devices.
INTERNATIONAL JOURNAL OF THERMOPHYSICS
(2023)
Article
Engineering, Multidisciplinary
Yuan Fang, Long-yuan Li, Jean-Baptiste Mawule Dassekpo, Sung-Hwan Jang
Summary: An analytical prediction model for the heat transfer analysis of two-phase composite materials is developed, taking into account various factors influencing the effective properties of composite materials. The validation of the model using experimental data demonstrates the accuracy and reliability of the model.
COMPOSITES PART B-ENGINEERING
(2021)
Article
Nanoscience & Nanotechnology
Yongjian Zhang, Ziyang Wang, Ning Li, Zhanxun Che, Xiaoyan Liu, Guo Chang, Jinpeng Hao, Jingjie Dai, Xitao Wang, Fangyuan Sun, Hailong Zhang
Summary: Manipulating the interfacial structure is crucial for enhancing the interfacial thermal conductance in Cu/diamond composites. This study investigates the interfacial thermal conductance between Cu and diamond with an interconnected interlayer and explores the relationship between interfacial structure and conductance. Experimental measurements and molecular dynamics simulations are conducted to analyze the effects of different interlayers on thermal conductance.
ACS APPLIED MATERIALS & INTERFACES
(2022)
Article
Construction & Building Technology
Dong Lu, Xianming Shi, Jing Zhong
Summary: This study investigates the interaction between carbon nanotubes (CNTs) and cement using CNT fibers as a platform. The findings reveal that oxidation treatment and graphene oxide (GO) nanocoating significantly enhance the interfacial bond strength between CNT and cement. Moreover, the observation of a continuous crystalline domain of calcium-silicate-hydrate (C-S-H) anchored to the GO nanosheets provides direct evidence for the seeding effect of GO on cement hydration.
CEMENT & CONCRETE COMPOSITES
(2022)
Article
Chemistry, Physical
Hyunjin Kim, Hyejin Yang, Suriyakumar Dasarathan, Doohun Kim, Joong Tark Han
Summary: This study presents a method to enhance the electrical performance of CNT films by controlling the wettability of LMWCNT films and the electrical conductivity of the Cu plating solution. Thermal deoxygenation was used to modify the CNT surface, providing high conductivity and hydrophilicity for uniform Cu electrodeposition in an aqueous electrolyte. The results show that Cu nucleates from inside the CNT film and grows on the surface, forming a densely packed CNT-Cu composite.
Article
Materials Science, Composites
Jun Li, Na Jiang, Chunxia Cheng, Guipeng Quan, Hengyu Feng, Weiwen Li, Linghan Xiao, Yuhui Ao
Summary: A solvent-free MWCNTs @Fe3O4 nanofluid was used to modify the water-based epoxy sizing agent for CFRPs. The addition of 2% MFNF significantly improved the mechanical properties of CFRPs, with ILSS and bending strength increased by 21.69% and 39.51%, respectively. Moreover, the Thermal conductivity was improved by 112.23% due to the excellent TC possessed by MWCNTs and the orientation of MFNF in thermal conductivity, which facilitates phonon propagation at the interface.
COMPOSITES SCIENCE AND TECHNOLOGY
(2023)
Article
Mechanics
J. S. Hu, B. L. Wang, H. Hirakata, Z. Li
Summary: A general model is established to evaluate the interfacial thermal damage and predict the fatigue life of the auxetic honeycomb-substrate structure (H-SS). The transient temperature field and thermal stresses are determined using the finite difference method. The interfacial thermal stress intensity factor is used to characterize stress concentration behavior, and based on this, the interfacial thermal damage evolution and fatigue life prediction of the structure are made. The results show that the auxetic property significantly enhances the fatigue life of the structure, and neglecting the effect of temperature-dependent material properties (TDMPs) undervalues the fatigue life. The influence of TDMPs on the fatigue life increases with the absolute value of the internal cell angle. This study provides a comprehensive assessment of thermal damage and fatigue life in auxetic H-SSs and serves as a theoretical foundation for future applications in extreme temperature environments.
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES
(2023)