Analysis of interfacial peeling in IC chip pick-up process

标题
Analysis of interfacial peeling in IC chip pick-up process
作者
关键词
-
出版物
JOURNAL OF APPLIED PHYSICS
Volume 110, Issue 7, Pages 073508
出版商
AIP Publishing
发表日期
2011-10-05
DOI
10.1063/1.3642975

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