期刊
JOURNAL OF ALLOYS AND COMPOUNDS
卷 582, 期 -, 页码 229-235出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2013.08.022
关键词
Aging time; Microstructure; Lattice parameter; Grain size; Yield strength
资金
- National Science Council of Taiwan [NSC89-2216-E-151-011]
The effects of aging time on the mechanical properties of the Sn-9Zn-1.5Ag-xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn-9Zn-1.5Ag-xBi solder alloys is composed of Sn-rich phase and AgZn3. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn-9Zn-1.5Ag solder alloys with various Bi contents before and after aging at 150 degrees C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 +/- 2.2 MPa for Sn-9Zn-1.5Ag-3Bi solder alloy before aging. (C) 2013 Elsevier B.V. All rights reserved.
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