Effect of carbon fiber surface treatment on Cu electrodeposition: The electrochemical behavior and the morphology of Cu deposits

出版年份 2010 全文链接

标题

作者

关键词

出版物

Volume 509, Issue 8, Pages 3532-3536

出版商

Elsevier BV

发表日期

2010-12-31

DOI

10.1016/j.jallcom.2010.12.170

Discuss science. Find collaborators. Network.

Join a conversation

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now