Article
Engineering, Electrical & Electronic
Zhai Xinmeng, Li Yuefeng, Zou Jun, Shi Mingming, Yang Bobo, Li Yang, Guo Chunfeng, Hu Rongrong
Summary: The study found that a soldering temperature of 270 degrees Celsius resulted in the lowest void ratio in the LED filament solder joint during reflow soldering, leading to lower steady-state voltage and junction temperature. As the void density decreased in the solder joint, the shear strength increased, resulting in higher shear resistance and mechanical reliability of the solder joint.
JOURNAL OF ELECTRONIC MATERIALS
(2021)
Article
Computer Science, Information Systems
Mauro Pipponzi, Alberto Sangiovanni-Vincentelli
Summary: Test for Reliability involves continuously stressing an IC device under various corner conditions and dynamically adjusting the test based on real-time observation of critical signals. Our approach goes beyond traditional reliability methods, covering the entire process from design to failure analysis.
Article
Materials Science, Multidisciplinary
Zhi Jin, Fupeng Huo, Jianhao Wang, Xunda Liu, Y. C. Chan, Hiroshi Nishikawa
Summary: This study examines the electromigration behavior of a flip-chip structured nano-Ag joint and compares it with a traditional solder joint, providing insights into the differences in their failure mechanisms.
MATERIALS CHARACTERIZATION
(2023)
Article
Automation & Control Systems
Xiangning Lu, Zhenzhi He, Hector Gutierrez, Guanglan Liao, Tielin Shi
Summary: This paper investigates a wavelet-based resolution enhancement technique to reconstruct a high-quality image for scanning acoustic microscopy (SAM) test and improve the detection accuracy of micro-defects in flip chip packages.
Article
Engineering, Multidisciplinary
Wei Wang, Xiangning Lu, Zhenzhi He, Tielin Shi
Summary: The paper utilizes scanning acoustic microscopy for non-destructive inspection of flip chip packages, and employs image super-resolution technique and convolutional neural network algorithm to enhance the detection accuracy, demonstrating significant improvement in the quality of flip chip package inspection.
MEASUREMENT SCIENCE AND TECHNOLOGY
(2021)
Article
Energy & Fuels
Chun-Kai Huang, Chung-Yu Chiu, Tse-Lin Lai, Cheng Cheng, Wei-Han Lai, Pai-Jung Chang, Jin-Long Wu, Chien-Hung Chiang, Chun-Guey Wu, Cheng-Yi Liu
Summary: The study found that using plasma-enhanced vapor deposition to process silicon nitride passivation can effectively reduce the efficiency degradation of perovskite solar cells; the characteristic time of reliability-tested solar cells can be calculated using the flip-chip package technology; and the concentration of O-2(g) in different environments is the main cause of efficiency degradation.
Article
Engineering, Electrical & Electronic
Menglong Li, Russel Torah, Jingqi Liu, John Tudor, Steve Beeby
Summary: In this paper, a three-dimensional model was developed using Finite element analysis to evaluate the shear load, tensile, bending and thermal stresses. Simulations of a complete flexible flip chip electronic packaging method were performed to improve the robustness and reliability of the packaged electronic device.
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
(2022)
Article
Chemistry, Analytical
Lei Yan, Peisheng Liu, Pengpeng Xu, Lipeng Tan, Zhao Zhang
Summary: In this paper, a model of flip-chip packing (FCP) GaN chip was established and the Ag sinter paste structure was adopted. The results showed that using underfill in FCP GaN chip packaging was a promising method to reduce package size and thermal stress. The choice of under bump metallurgy (UBM) material had little effect on the thermal condition of the module. Nano-silver was found to be the most suitable bump material for FCP GaN chip, and Al was a more reliable option for UBM material.
Article
Engineering, Electrical & Electronic
Chu Tang, Wenhui Zhu, Zhuo Chen, Liancheng Wang
Summary: Thermal compression bonding (TCB) process with Ni layer was studied for Cu/Sn-3.5Ag solder joints. Results showed Ni layer prevented Cu diffusion in Sn-3.5Ag and improved joint strength. Aging led to different growth rates and fracture locations for solder joints of varying sizes.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2021)
Article
Engineering, Electrical & Electronic
Cody J. Marbut, Bakhtiyar Nafis, David Huitink
Summary: This study introduces an alternative reliability testing apparatus and protocol to investigate solder fatigue mechanisms at the device scale, aiming to achieve rapid testing times with minimal cost while preserving accuracy in fatigue life prediction.
MICROELECTRONICS RELIABILITY
(2021)
Article
Engineering, Electrical & Electronic
Qing Lu, Zhaojiang Shang, Yuxuan Zhu, Chengyu Guan, Li Wang, Bobo Yang, Mingming Shi, Jun Zou
Summary: This study investigated the reliability of flip-chip LED filaments with different color temperatures through three aging tests, finding that the high temperature-high humidity environment had the greatest impact, particularly on filaments with color temperatures of 4000 K and 5000 K. Filaments with a color temperature of 2700 K exhibited the best reliability and minimal changes in various indicators after aging tests, showing their suitability for a wide range of applications.
JOURNAL OF ELECTRONIC MATERIALS
(2021)
Article
Engineering, Electrical & Electronic
Jing Li, Jianan Wu, Liang Chen, Xiaoshuai An, Jiahao Yin, Yiping Wu, Ling Zhu, Hanxiang Yi, Kwai Hei Li
Summary: The fabrication of GaN light-emitting diodes with on-chip photodetectors based on flip-chip configuration is reported in this study. The research focuses on the characterization of the same InGaN/GaN quantum well structure in both LED and PD, as well as studying the light-detecting mechanism of on-chip PDs. The flip-chip packaging device allows for the integration of a yellow phosphor film onto the sapphire surface to generate white light emission, while the on-chip PD is capable of real-time detection of LED intensity without blocking light output emission.
JOURNAL OF LIGHTWAVE TECHNOLOGY
(2021)
Article
Chemistry, Physical
Wan-Chun Chuang, Wei-Long Chen
Summary: This study successfully established a strip warpage simulation model for the flip-chip process and investigated the effects of structural design and process parameters on strip warpage. The errors between simulated and experimental values were less than 8%. Taguchi analysis revealed that die thickness and substrate thickness were the key factors affecting strip warpage, followed by mold compound thickness and molding temperature. Increasing die and mold compound thickness reduces strip warpage but increases overall strip thickness. Design criteria were proposed to overcome this issue, which effectively reduced strip warpage and overall strip thickness.
Article
Physics, Applied
Xuegang Li, Yingshan Zhang, Chuhong Yang, Zhiyuan Li, Junhua Wang, Tang Su, Mo Chen, Yongchao Li, Chengyao Li, Zhenyu Mi, Xuehui Liang, Chenlu Wang, Zhen Yang, Yulong Feng, Kehuan Linghu, Huikai Xu, Jiaxiu Han, Weiyang Liu, Peng Zhao, Teng Ma, Ruixia Wang, Jingning Zhang, Yu Song, Pei Liu, Ziting Wang, Zhaohua Yang, Guangming Xue, Yirong Jin, Haifeng Yu
Summary: Significant progress has been made in building large-scale superconducting quantum processors based on flip-chip technology. A modified transmon qubit, called flipmon, has been realized using flip-chip technology, with a large shunt capacitor replaced by a vacuum-gap parallel plate capacitor. Through well-designed geometry and good surface treatment, the coherence of the flipmons can be further improved.
APPLIED PHYSICS LETTERS
(2021)
Article
Engineering, Electrical & Electronic
Yue Huang, Zhi-Kai Gan, Chun Lin
Summary: Using laser scanning confocal microscopy measurement, a concise method for extracting the indium bump shape in microelectronics was established and validated by modeling bump deformation and predicting flip-chip gap. This non-destructive method proves reliable in predicting flip-chip gaps of 10 microns or less.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
(2023)
Article
Engineering, Mechanical
Chun Cheng, Wei Zou, Weiping Wang, Michael Pecht
Summary: In this study, a deep sparse filtering network (DSFN) is proposed for intelligent fault diagnosis of rotating machinery. Pre-training with sparse filtering and fine-tuning using back-propagation algorithm can help DSFN adaptively learn discriminative features from datasets and achieve higher diagnostic accuracy with fewer training samples compared to classical methods.
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART D-JOURNAL OF AUTOMOBILE ENGINEERING
(2022)
Review
Engineering, Aerospace
Siyu Zhang, Lei Su, Jiefei Gu, Ke LI, Lang Zhou, Michael Pecht
Summary: In practical mechanical fault detection and diagnosis, transfer learning combined with deep learning can improve the performance of the target task while reducing the demand for large-scale supervised data and high computation power. However, direct transfer may lead to a significant reduction in detection performance due to domain differences. Domain adaptation strategies can address this issue by transferring distribution information from the source domain to the target domain. This survey reviews various current domain adaptation strategies combined with deep learning and analyzes their principles, advantages, and disadvantages, as well as their application in fault diagnosis.
CHINESE JOURNAL OF AERONAUTICS
(2023)
Article
Computer Science, Information Systems
Shehla Amir, Moneeba Gulzar, Muhammad O. Tarar, Ijaz H. Naqvi, Nauman A. Zaffar, Michael G. Pecht
Summary: This paper proposes a method to accurately estimate the state of health (SOH) of lithium-ion batteries using a 2-RC model, considering factors such as time and temperature. Compared to the traditional 1-RC model, this method has significant advantages in capturing battery degradation and reducing computational costs.
Article
Computer Science, Information Systems
Varun Khemani, Michael H. Azarian, Michael G. Pecht
Summary: This paper introduces a novel technique called learnable wavelet scattering networks for fault diagnosis of circuits and rotating machinery. By optimizing the operators of this network, higher fault diagnosis accuracy can be achieved, and it also has good generalization and transfer learning performance in fault diagnosis in different domains.
Article
Energy & Fuels
Lingxi Kong, Diganta Das, Michael G. Pecht
Summary: This paper discusses the counterfeiting issues of lithium-ion batteries, their entry into the market, and the challenges of detection. The suggestion is for device manufacturers and retail stores to characterize the batteries they receive, and for related authorities to set standards for a universal battery tracking method.
Article
Computer Science, Artificial Intelligence
Zhenyu Wu, Hongkui Zhang, Juchuan Guo, Yang Ji, Michael Pecht
Summary: A deep adversarial transfer learning model (Deep Imba-DA) is proposed in this paper to tackle the issues of class imbalances and distributional discrepancies in bearing fault diagnosis.
EXPERT SYSTEMS WITH APPLICATIONS
(2022)
Article
Engineering, Civil
Yinghong Zhao, Xiao He, Donghua Zhou, Michael G. Pecht
Summary: This paper presents a new method for real-time detection and isolation of wheelset intermittent over-creeps (WIOs), combining the variable-to-minimum difference (VMD) index and the weighted moving average (WMA) technique. Experimental results demonstrate the effectiveness of the developed method.
IEEE TRANSACTIONS ON INTELLIGENT TRANSPORTATION SYSTEMS
(2022)
Article
Engineering, Industrial
Hao Lyu, Hongchen Qu, Zaiyou Yang, Li Ma, Bing Lu, Michael Pecht
Summary: The dependent competing failure process model has become increasingly important in reliability research, particularly for the o shock model. The aging effect of a system affects recovery time and the changing of o-value. Damaged shocks have three different effects on systems. An example of a microelectromechanical system is used to demonstrate the applicability of the reliability model. Sensitivity analysis is conducted to evaluate the impact of parameters on reliability.
RELIABILITY ENGINEERING & SYSTEM SAFETY
(2023)
Article
Energy & Fuels
Simin Peng, Liyang Zhu, Zhenlan Dou, Dandan Liu, Ruixin Yang, Michael Pecht
Summary: This paper develops a site selection and capacity setting model of battery energy storage system (BESS) based on power grid node load. A modified simulated annealing genetic algorithm is used to optimize the site and capacity of BESS, aiming to minimize the average daily distribution networks loss. Simulation results show that the developed method accelerates the convergence speed and reduces the convergence time by about 30%. Furthermore, the required number and capacity of BESS are determined based on the real batteries grouping design.
Article
Engineering, Mechanical
Seong-woo Woo, Dennis L. O'Neal, Michael Pecht
Summary: Parametric accelerated life testing (ALT) with the reliability quantitative (RQ) statements is a methodology used to identify and rectify design flaws. It includes testing the lifetime, fatigue design, making alterations to the testing process, and determining whether the design meets the desired lifetime. In this case study of refrigerator fatigue failures during rail transport, the failures were attributed to the compressor mount design, but were successfully resolved after redesigning the mounts and tubes.
MECHANICAL SYSTEMS AND SIGNAL PROCESSING
(2023)
Article
Thermodynamics
Simin Peng, Yunxiang Sun, Dandan Liu, Quanqing Yu, Jiarong Kan, Michael Pecht
Summary: This paper proposes a battery state of health estimation method based on multi-health features extraction and an improved long short-term memory neural network. The correlation between multi-health features and state of health is evaluated by the grey relational analysis. Improved quantum particle swarm optimization algorithm is used to obtain the hyper-parameters. The experimental results show high estimation accuracy and robustness of the proposed method.
Article
Engineering, Electrical & Electronic
Mehdi Kohani, Javad Meiguni, David J. Pommerenke, Michael G. Pecht
Summary: Wearable medical devices are commonly used for patient monitoring and treatment, but they can be affected by electrostatic discharge. This study investigates the severe discharges that can occur in healthcare environments and characterizes their current waveforms.
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
(2023)
Article
Engineering, Electrical & Electronic
Muhammad Osama Tarar, Naveed Ul Hassan, Ijaz Haider Naqvi, Michael Pecht
Summary: Electric vehicle battery swapping stations provide a suitable balance between swapping time and battery health indicators, promoting EV adoption and transport electrification. Fair and affordable prices can be determined, considering battery health and implementing appropriate pricing strategies. The battery's health and remaining useful life can be monitored during swapping, without significant increase in swapping time. The cost and feasibility of the swapping station model are compared with home and commercial charging stations, showing favorable results.
IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION
(2023)
Article
Electrochemistry
Simin Peng, Ao Zhang, Dandan Liu, Mengzeng Cheng, Jiarong Kan, Michael Pecht
Summary: Accurate SOC estimation is crucial for battery management systems to prolong battery lifespan and ensure safety. To address the inaccuracies and divergence issues in SOC estimation of lithium-ion batteries using Kalman filters, a method based on improved square-root unscented Kalman filter and dual-coefficient tracker is proposed. The developed algorithm demonstrates the highest level of accuracy with SOC error within 1.5%.
Article
Engineering, Electrical & Electronic
Dazhi Wang, Sihan Wang, Deshan Kong, Jiaxing Wang, Wenhui Li, Michael Pecht
Summary: The study aims to predict the electromagnetic field and output performance of permanent magnet eddy current devices (PMECDs) using a proposed physics-informed sparse neural network (PISNN). A unified physical model is defined for different PMECDs, solving a parameterized magnetic quasi-static problem. The model integrates soft and hard constraint modules, with physical equations, into the objective function and utilizes stochastic gradient descent for training. Results demonstrate accurate and efficient predictions of the EM field distribution and output torque, showcasing the potential for transfer learning.
IEEE MAGNETICS LETTERS
(2023)
