Thin film forming technique based on hybrid spray coating using electrostatic force and air pressure

Previously fabricated electronic devices were used for vacuum manufacturing processes such as conventional semiconductor manufacturing. However, they are difficult to apply to continuous processes such as roll-to-roll printing, which results in very high device manufacturing and processing costs. Therefore, many developers have been interested in applying continuous processes to contact printing or noncontact printing technologies and they proposed various continuous printing techniques instead of conventional batch coating. In this paper, a hybrid spray coating technique is proposed for use in various organic electronic device fabrication processes on the basis of noncontact printing technique. This hybrid spray coating technique is a combination of electrostatic spraying and air pressure spraying. Using this technique we obtained smaller particles and shorter deposition time than by the conventional spray coating using a single nozzle. (C) 2014 The Japan Society of Applied Physics