Microjoining of LSI Chips on Poly(ethylene naphthalate) Using Compliant Bump

标题
Microjoining of LSI Chips on Poly(ethylene naphthalate) Using Compliant Bump
作者
关键词
-
出版物
JAPANESE JOURNAL OF APPLIED PHYSICS
Volume 50, Issue 6S, Pages 06GM05
出版商
Japan Society of Applied Physics
发表日期
2013-12-21
DOI
10.7567/jjap.50.06gm05

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