Multiscale simulation of thermal contact resistance in electronic packaging

标题
Multiscale simulation of thermal contact resistance in electronic packaging
作者
关键词
-
出版物
INTERNATIONAL JOURNAL OF THERMAL SCIENCES
Volume 83, Issue -, Pages 16-24
出版商
Elsevier BV
发表日期
2014-05-14
DOI
10.1016/j.ijthermalsci.2014.04.006

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