期刊
INTERNATIONAL JOURNAL OF THERMAL SCIENCES
卷 70, 期 -, 页码 114-126出版社
ELSEVIER FRANCE-EDITIONS SCIENTIFIQUES MEDICALES ELSEVIER
DOI: 10.1016/j.ijthermalsci.2013.03.015
关键词
Thermal management of electronics; Heat sinks; Thermal energy storage; Phase change materials; Internal fins; Melting temperature
资金
- National Natural Science Foundation of China (NSFC) [51276159]
- China Postdoctoral Science Foundation (CPSF) [2012M511362]
Experiments were conducted to investigate the effects of melting temperature and the presence of internal fins on the performance of a phase change material (PCM)-based heat sink for thermal management of electronics. At various intensive pulsed heat loads, comparisons were made between two PCMs with close thermophysical properties but different melting temperatures. The performance of an unfinned heat sink was also compared with its finned version. It was found that the use of a PCM with a higher melting temperature can extend a longer time of protection of the target devices from overheating, and that it also facilitates cooling for recovering the heat sink for subsequent operations. A lower melting temperature, however, is possibly favored because it may enable a prompt protection of the target devices. Selection of the PCM with an appropriate melting temperature depends strongly on the thermal conditions exerted. In contrast, employment of internal fins was shown to be always preferred as the performance of the heat sink can be improved, regardless of the PCM adopted. In the cases studied, the maximum temperature rise was lowered by up to 10 degrees C for the finned heat sink. (C) 2013 Elsevier Masson SAS. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据