Development of Polyaniline/Epoxy Composite as a Prospective Solder Replacement Material

标题
Development of Polyaniline/Epoxy Composite as a Prospective Solder Replacement Material
作者
关键词
-
出版商
Informa UK Limited
发表日期
2010-10-15
DOI
10.1080/00914037.2010.504150

向作者/读者发起求助以获取更多资源

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started