Interfacial stress analysis and prediction of debonding for a thin plate bonded to a curved substrate

This paper focuses on the analytical and numerical modeling of the interface between a rigid substrate with simple constant curvature and a thin bonded plate. The interfacial behavior is modeled by independent cohesive laws in the normal and tangential directions, coupled with a mixed-mode fracture criterion. The newly developed analytical model determines the interfacial shear and normal stress distributions as functions of the substrate curvature, during the various behavioral stages of the interface prior to the initiation of debonding. The model is also able to predict the debonding load and the effective bond length. In the numerical model the interface is modeled by zero-thickness node-to-segment contact elements, in which both the geometrical relationships between the nodes of the discretized problem and the interface constitutive laws are suitably defined. Numerical results and comparisons between the predictions of the two models are presented. (c) 2009 Elsevier Ltd. All rights reserved.