Large “near junction” thermal resistance reduction in electronics by interface nanoengineering

出版年份 2011 全文链接

标题

Large “near junction” thermal resistance reduction in electronics by interface nanoengineering

作者

关键词

-

出版物

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Volume -, Issue -, Pages -

出版商

Elsevier BV

发表日期

2011-09-15

DOI

10.1016/j.ijheatmasstransfer.2011.08.027

向作者/读者发起求助以获取更多资源

Protocol

Reagent

Reprint

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

© Peeref 2019-2024. All rights reserved.