Strength of silicon wafers: fracture mechanics approach

标题
Strength of silicon wafers: fracture mechanics approach
作者
关键词
-
出版物
INTERNATIONAL JOURNAL OF FRACTURE
Volume 155, Issue 1, Pages 67-74
出版商
Springer Nature
发表日期
2009-03-02
DOI
10.1007/s10704-009-9324-9

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