UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process

标题
UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process
作者
关键词
-
出版物
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
Volume 44, Issue -, Pages 138-143
出版商
Elsevier BV
发表日期
2013-02-26
DOI
10.1016/j.ijadhadh.2013.02.005

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