期刊
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
卷 35, 期 -, 页码 36-49出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.ijadhadh.2011.11.010
关键词
Finite element stress analysis; Stress distribution; Mechanical properties of adhesives; Joint design; Functionally graded bondline
资金
- Space Vehicle Technology Institute [NCC3-989]
- NASA
- Department of Defense
- NASA Glenn Research Center through the GSRP
Adhesives with functionally graded material properties are being considered for use in adhesively bonded joints to reduce the peel stress concentrations located near adherend discontinuities. Several practical concerns impede the actual use of such adhesives. These include increased manufacturing complications, alterations to the grading due to adhesive flow during manufacturing, and whether changing the loading conditions significantly impact the effectiveness of the grading. An analytical study is conducted to address these three concerns. An enhanced joint finite element, which uses an analytical formulation to obtain exact shape functions, is used to model the joint. Furthermore, proof-of-concept testing is conducted to show the potential advantages of functionally graded adhesives. In this study, grading is achieved by strategically placing glass beads within the adhesive layer at different densities along the joint. (C) 2012 Elsevier Ltd. All rights reserved.
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