Development of Cryopackaging and I/O Technologies for High-Speed Superconductive Digital Systems

出版年份 2008 全文链接

标题

作者

关键词

出版物

Volume E91-C, Issue 3, Pages 325-332

出版商

Institute of Electronics, Information and Communications Engineers (IEICE)

发表日期

2008-03-10

DOI

10.1093/ietele/e91-c.3.325

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