Large-Payload Climbing in Complex Vertical Environments Using Thermoplastic Adhesive Bonds

标题
Large-Payload Climbing in Complex Vertical Environments Using Thermoplastic Adhesive Bonds
作者
关键词
-
出版物
IEEE Transactions on Robotics
Volume 29, Issue 4, Pages 863-874
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2013-04-19
DOI
10.1109/tro.2013.2256312

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