State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography

出版年份 2014 全文链接

标题

作者

关键词

出版物

Volume 29, Issue 9, Pages 5000-5009

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2014-05-02

DOI

10.1109/tpel.2013.2288334

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