期刊
IEEE TRANSACTIONS ON POWER ELECTRONICS
卷 27, 期 11, 页码 4799-4816出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TPEL.2012.2198891
关键词
High-frequency soft-magnetic materials; integrated passives; magnetics on silicon; nano-structured magnetic materials; power supply on chip; power supply in package
资金
- EU
- Irish Government
- European Union
- Enterprise Ireland
- Science Foundation Ireland
- Microelectronics Competence Centre Ireland (MCCI)
- US-based Power Sources Manufacturers Association
This paper reviews the current state of power supply technology platforms and highlights future trends and challenges toward realizing fully monolithic power converters. This paper presents a detailed survey of relevant power converter technologies, namely power supply in package and power supply on chip (PwrSoC). The performance of different power converter solutions reported in the literature is benchmarked against existing commercial products. This paper presents a detailed review of integrated magnetics technologies, primarily microinductors, a key component in realizing a monolithic power converter. A detailed review and comparison of different microinductor structures and the magnetic materials used as inductor cores is presented. The deposition techniques for integrating the magnetic materials in the microinductor structures are discussed. This paper proposes the use of two performance metrics or figures of merit in order to compare the dc and ac performance of individual microinductor structures. Finally, the authors discuss future trends, key challenges, and potential solutions in the realization of the holy grail of monolithically integrated power supplies (PwrSoC).
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