Inductively Coupled Pulsed Plasmas in the Presence of Synchronous Pulsed Substrate Bias for Robust, Reliable, and Fine Conductor Etching

出版年份 2009 全文链接

标题

作者

关键词

出版物

Volume 37, Issue 9, Pages 1730-1746

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2009-08-26

DOI

10.1109/tps.2009.2028071

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