Novel Solder-Magnetic Particle Composites and Their Reflow Using AC Magnetic Fields

标题
Novel Solder-Magnetic Particle Composites and Their Reflow Using AC Magnetic Fields
作者
关键词
-
出版物
IEEE TRANSACTIONS ON MAGNETICS
Volume 46, Issue 6, Pages 2187-2190
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2010-05-28
DOI
10.1109/tmag.2010.2044640

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