4.6 Article Proceedings Paper

Exploration of power device reliability using compact device models and fast electrothermal simulation

期刊

IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
卷 44, 期 3, 页码 894-903

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TIA.2008.921388

关键词

compact modeling; electrothermal simulation; mission profile; power semiconductor devices; rainflow cycle counting; reliability; thermal cycling

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This paper presents the application of compact insulated gate bipolar transistor and p-i-n diode models, including features such as local lifetime control and field-stop technology, to the full electrothermal system simulation of a hybrid electric vehicle converter using a lookup table of device losses. The vehicle converter is simulated with an urban driving cycle (the Federal Urban Driving Schedule), which is used to generate transient device temperature profiles. A methodology is also described to explore the converter reliability using the temperature profile, with rainflow cycle counting techniques from material fatigue analysis. The effects of ambient temperature, driving style, and converter design on converter reliability are also investigated.

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