Heat Dissipation in Resistive Switching Devices: Comparison of Thermal Simulations and Experimental Results

标题
Heat Dissipation in Resistive Switching Devices: Comparison of Thermal Simulations and Experimental Results
作者
关键词
-
出版物
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 61, Issue 4, Pages 1137-1144
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2014-02-28
DOI
10.1109/ted.2014.2305175

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