期刊
IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 59, 期 2, 页码 342-348出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2011.2176943
关键词
Atomic layer deposited (ALD); fixed charge density; interface trap density; surface passivation
资金
- EPSCoR
- Office Of The Director [0903804] Funding Source: National Science Foundation
This paper studies the chemical and field effect passivation properties of silicon surfaces by thin hafnium oxide (HfO2) and aluminum oxide (Al2O3) layers grown by chemical-vapor-based atomic layer deposition method. Using a rigorous metal-oxide-semiconductor model and results from capacitance-voltage measurements, the density of fixed charges (N-f) and the density of interface traps (D-it) at the HfO2/Si and Al2O3/Si interfaces were obtained. Microwave photoconductivity decay measurements were used to characterize interface recombination velocities at these interfaces.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据