Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation

High-Density 3-D Interconnect of Cu–Cu Contacts With Enhanced Contact Resistance by Self-Assembled Monolayer (SAM) Passivation

(2011) Lan Peng et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing

(2011) Takafumi Fukushima et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits

(2010) T. Fukushima et al.   APPLIED PHYSICS LETTERS

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

(2010) Suk-Kyu Ryu et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Hybrid Microassembly Combining Robotics and Water Droplet Self-Alignment

(2010) Veikko Sariola et al.   IEEE Transactions on Robotics

Self-alignment of silicon chips on wafers: A capillary approach

(2010) J. Berthier et al.   JOURNAL OF APPLIED PHYSICS

A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module

(2010) Kang-Wook Lee et al.   JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

Challenges for Capillary Self-Assembly of Microsystems

(2010) Massimo Mastrangeli et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 μm pitch applications

(2009) Ho-Young Son et al.   JOURNAL OF APPLIED PHYSICS

Conformal dip-coating of patterned surfaces for capillary die-to-substrate self-assembly

(2009) M Mastrangeli et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Alternative approach in 3D MEMS-IC integration using fluidic self-assembly techniques

(2009) Y A Chapuis et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Through-Silicon Via (TSV)

(2009) Makoto Motoyoshi   PROCEEDINGS OF THE IEEE