4.6 Article

Understanding Strain-Induced Drive-Current Enhancement in Strained-Silicon n-MOSFET and p-MOSFET

期刊

IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 57, 期 6, 页码 1343-1354

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2010.2046461

关键词

CMOS; electrical field; MOSFET; mobility enhancement; SiGe; strain; strained overlayer film; strained silicon; strained silicon-on-insulator (sSOI); stress; stress memorization technique (SMT)

资金

  1. German Federal Ministry of Education and Research [01M3167B]

向作者/读者索取更多资源

Strain greatly affects the electrical properties of silicon because strain changes the energy band structure of silicon. In MOSFET devices, the terminal voltages induce electrical fields, which themselves modulate the electronic band structure and interact with strain-induced changes. Applied electrical fields are used to experimentally study different state-of-the-art local and global strain techniques and reveal the different responses of n- and p-MOSFETs to the different strain techniques. It is shown that p-MOSFETs have more low-lateral-field linear drive-current enhancement and less high-lateral-field saturation drive-current enhancement at both low and high vertical fields. The situation is similar for n- MOSFETs at low vertical fields. However, at high vertical fields, n- MOSFET low-lateral-field linear drive-current enhancement is less than the high-lateral-field saturation drive-current enhancement. The origin for this behavior can be found in the different strain effects on the electronic band structure, which results in effective mass reduction and/or scattering suppression. These, in turn, contribute differently to linear and saturation drive-current enhancements in n- and p-MOSFETs.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.6
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据