Microstructure and dielectric characterization of micro- nanosize co-filled composite films with high dielectric permittivity

出版年份 2011 全文链接

标题

作者

关键词

出版物

IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION

Volume 18, Issue 5, Pages 1518-1525

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2011-10-14

DOI

10.1109/tdei.2011.6032820

向作者/读者发起求助以获取更多资源

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION

向作者/读者发起求助以获取更多资源

Protocol

Reagent

Reprint

Discover Peeref hubs

Publish scientific posters with Peeref