Article
Engineering, Electrical & Electronic
Marina Antoniou, Florin Udrea, Elizabeth Kho Ching Tee, Alex Hoelke
Summary: PSOI technology is a suitable choice for high-voltage integrated circuits, offering a wider range of voltage ratings, lower on-state resistance, and better heat conduction. In this study, a PSOI technology platform is introduced, which can achieve voltage ratings ranging from 45 to 400V, while providing low on-state resistance, good hot carrier injection stability, and electrostatic discharge capability for high-voltage devices.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2022)
Article
Optics
Junhu Zhou, Jie You, Hao Ouyang, Runlin Miao, Xiang'ai Cheng, Tian Jiang
Summary: This study presents a theoretical analysis of a novel multi-channel light amplification photonic system on chip, utilizing the nonlinear Raman amplification phenomenon in silicon wire waveguides and a temperature insensitive Mach-Zehnder interferometer filter as demultiplexer. The system incorporates various optical effects to achieve thermal robustness and prevent thermal interference, showing promising potential for future applications.
CHINESE OPTICS LETTERS
(2022)
Article
Engineering, Electrical & Electronic
Li Lu, Zhihan Zhu, Yixin Dai, Siyang Liu, Weifeng Sun, Long Zhang, Feng Lin, Jinyu Xiao, Jun Sun
Summary: In this study, the reliabilities and inner mechanisms of high-voltage silicon-on-insulator lateral insulated gate bipolar transistors (SOI-LIGBTs) under repetitive electro-static discharge (ESD) stresses were comprehensively investigated for better application in high-voltage circuits. It was found that the worst repetitive ESD stress occurred when the SOI-LIGBT was snapbacked with the turn-ON of the parasitic transistor. The ON-state voltage (V-on) and collector-to-emitter current density (J(ce)) decreased as the stressing times due to hot-hole injection and interface states generation. To mitigate the degradation of J(ce), a P-top layer structure was proposed and fabricated, which showed effective improvement in reducing the hot-carrier effects.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2023)
Article
Engineering, Electrical & Electronic
Qiwen Zheng, Jiangwei Cui, Xuefeng Yu, Yudong Li, Wu Lu, Chengfa He, Qi Guo
Summary: This article investigates the impact of Total Ionizing Dose (TID) on the within-wafer variability of Radiation-Hardened (RH) Silicon-on-Insulator (SOI) wafers. The experimental results show a complex dependence of the within-wafer variability on TID, influenced by positively charged silicon nanoclusters introduced by silicon ion implantation. Additionally, a radiation hardness assurance method based on sample testing of limited wafer locations is discussed for reasonable estimation of within-wafer variability on TID irradiated devices.
IEEE TRANSACTIONS ON NUCLEAR SCIENCE
(2021)
Article
Engineering, Electrical & Electronic
Amr Ahmed, Gabriel M. Rebeiz
Summary: This article presents a wideband mm-wave passive harmonic rejection mixer (HRM) operating at 8 to 30 GHz with innovative design, achieving wide instantaneous bandwidth and low power consumption. The measured results demonstrate high harmonic rejection ratio and good linearity across the frequency range, making it suitable for high linearity 5G systems and wideband receivers.
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
(2023)
Article
Chemistry, Analytical
Zebin Xu, Jiahui Yan, Meilin Ji, Yongxin Zhou, Dandan Wang, Yuanzhi Wang, Zhihong Mai, Xuefeng Zhao, Tianxiang Nan, Guozhong Xing, Songsong Zhang
Summary: This paper presents a piezoresistive differential pressure sensor based on a silicon-on-insulator (SOI) structure for low-pressure detection. By optimizing the process, the sensor achieves a controllable thickness of the pressure-sensing diaphragm and ensures good ohmic contact. The experimental results show that the sensor has high sensitivity, temperature stability, and is suitable for high-temperature and miniaturized low-pressure sensor research.
Article
Engineering, Electrical & Electronic
Ali Esmailiyan, Elena Blokhina, Dennis Andrade M. Miceli, Eoin Faust, Panagiotis Giounanlis, Dirk Leipold, Hongying Wang, Imran Bashir, Eugene Koskin, Teerachot Siriburanon, Robert Bogdan Staszewski
Summary: In this paper, an embedded picoampere-level leakage current sensor with low hardware complexity is presented for quantum computing applications. It senses the leakage current on a capacitive DAC (CDAC) used to control the energy confinement levels and quantum states of a nearby quantum dot structure integrated on the same die.
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS
(2023)
Article
Engineering, Electrical & Electronic
Daniel Gheysens, Alain Fleury, Stephane Monfray, Frederic Gianesello, Philippe Cathelin, David Troadec, Jean Francois Robillard, Emmanuel Dubois
Summary: This article discusses the use of airgaps in the interconnect network of SOI-CMOS-based RF switches to reduce OFF-state capacitance without affecting ON-state resistance. Experimental and simulation results demonstrate that introducing airgaps in the interconnect layer can effectively reduce the OFF-state capacitance.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2023)
Article
Chemistry, Physical
Yexin Chen, Qinghai Zhu, Xiaodong Zhu, Yijun Sun, Zhiyuan Cheng, Jing Xu, Mingsheng Xu
Summary: In this study, a gate-tunable, high-performance, self-driving, and wide detection range phototransistor based on a 2D PtSe2 on silicon-on-insulator (SOI) was proposed. The phototransistor showed fast response time and excellent photodetection performance over a broad spectral range from ultraviolet to near-infrared.
Article
Multidisciplinary Sciences
Yuchen Qiu, Bo Zhang, Junchuan Yang, Hanfei Gao, Shuang Li, Le Wang, Penghua Wu, Yewang Su, Yan Zhao, Jiangang Feng, Lei Jiang, Yuchen Wu
Summary: The authors achieved high mobility and stretchability in polymer microstructures using a capillary-gradient assembly method, providing a new solution for soft electronic devices. Through highly ordered molecular packing, controllable pattern design, and wafer-scale homogeneity, they fabricated curvilinear polymer microstructure arrays with hole mobilities of 4.3 cm(2) V-1 s(-1) and 2.6 cm(2) V-1 s(-1), enabling the assembly of high-performance soft electronic devices and circuits.
NATURE COMMUNICATIONS
(2021)
Article
Engineering, Electrical & Electronic
Xu Zhang, Fanyu Liu, Bo Li, Can Yang, Yang Huang, Peng Lu, Siyuan Chen, Jinxing Cheng, Qingbo Wang, Ai Yu, Tiexin Zhang, Zhongshan Zheng, Qingzhu Zhang, Huaxiang Yin, Jiajun Luo
Summary: This study investigates the synergetic effects of total ionization dose and high-temperature stress on silicon on insulator (SOI) FinFETs. The results show that the threshold voltage degradation worsens for n-SOI FinFETs but weakens for p-SOI FinFETs. The ON-state current of n-SOI FinFETs is significantly enhanced, while the change of p-SOI FinFETs is weak under the synergetic effects.
IEEE TRANSACTIONS ON NUCLEAR SCIENCE
(2022)
Article
Engineering, Electrical & Electronic
Jiahui Yao, Chao Cheng, Han Xue, Xingyu Li, Yulan Lu, Bo Xie, Junbo Wang, Deyong Chen, Jian Chen
Summary: This article presents a high-sensitivity resonant differential pressure microsensor based on wafer-level eutectic bonding. The microsensor includes dual resonators embedded in the pressure-sensitive diaphragm and a silicon cap to form a vacuum cavity. Differential pressures cause deflections of the diaphragm and result in shifts in resonant frequencies. The microsensor exhibits excellent performance with a differential pressure sensitivity of 181.53 Hz/kPa and a maximum fitting error of less than 80 Pa.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2023)
Article
Automation & Control Systems
Fumihiro Inoue, Alain Phommahaxay, Yohei Gokita, Berthold Moeller, Eric Beyne
Summary: The surface planer process was used to minimize the nonuniformity caused by the nonoptimized Cu pillar and Si thinning processes. The planarized Cu pillars showed a substantial reduction in height variation, and the surface of the pillars became flat and uniform. The thickness variation of the backgrind tape-laminated Cu pillar wafer and the Si thinning were significantly reduced by the surface planer process. These results indicate that the surface planer process is a promising method for achieving high coplanarity and advancing advanced packaging.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
(2022)
Article
Engineering, Electrical & Electronic
E. Catapano, T. Mota Frutuoso, M. Casse, G. Ghibaudo
Summary: In this article, an explanation is proposed for the origin of the zero-temperature coefficient (ZTC) in fully depleted-silicon on insulator (FD-SOI) MOSFETs capacitance curves from room to cryogenic temperature. It is shown that the ZTC is a natural result of the Fermi-Dirac function controlling carrier population. Additionally, it is demonstrated that the ZTC point is preserved in the drain current transfer characteristics only if the mobility varies as the reciprocal temperature, indicating purely phonon scattering-limited behavior. The inclusion of other defective scattering mechanisms eliminates the ZTC point.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2023)
Article
Engineering, Electrical & Electronic
Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto
Summary: This study introduces a new pixel-parallel three-layer stacked complementary metal-oxide-semiconductor image sensor. With the use of hybrid bonding and silicon-on-insulator (SOI) wafers, the sensor achieves multilayer stacking and pixel-parallel signal processing. The three-layered pixel features a photodiode, pulse generation circuit, and counters, serving as analog-to-digital converters (ADCs) and reducing its size compared to conventional sensors. The developed technology demonstrates high-performance characteristics and the potential for various applications, such as high-quality video cameras, recognition, automotive systems, robots, and Internet-of-Things devices.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2023)
Article
Computer Science, Hardware & Architecture
Semih Tuerk, Alexander Schug, Reinhard Viga, Andreas Jupe, Holger Vogt
INTEGRATION-THE VLSI JOURNAL
(2019)
Article
Engineering, Electrical & Electronic
Marvin Michel, Holger Vogt
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2019)
Proceedings Paper
Engineering, Electrical & Electronic
Jan F. Haase, Andre Buchner, Sara Grollius, Jennifer Ruskowski, Holger Vogt
QUANTUM SENSING AND NANO ELECTRONICS AND PHOTONICS XVII
(2020)
Proceedings Paper
Engineering, Electrical & Electronic
Christian Walk, Alexander Netaev, Matthias Wiemann, Michael Goertz, Holger Vogt, Wilfried Mokwa, Karsten Seidl
2019 20TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS & EUROSENSORS XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)
(2019)
Proceedings Paper
Engineering, Electrical & Electronic
Sonja Allani, Andreas Jupe, Holger Kappert, Holger Vogt
2019 20TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS & EUROSENSORS XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)
(2019)
Proceedings Paper
Optics
Jan F. Haase, Maik Beer, Olaf Schrey, Jennifer Ruskowski, Werner Brockherde, Holger Vogt
QUANTUM SENSING AND NANO ELECTRONICS AND PHOTONICS XVI
(2019)
Proceedings Paper
Optics
L. Girgenrath, M. Hofmann, R. Kuehnhold, H. Vogt
OPTICS, PHOTONICS AND LASER TECHNOLOGY 2017
(2019)
Proceedings Paper
Engineering, Electrical & Electronic
Marvin Michel, Holger Vogt
2019 15TH CONFERENCE ON PHD RESEARCH IN MICROELECTRONICS AND ELECTRONICS (PRIME)
(2019)
Proceedings Paper
Engineering, Electrical & Electronic
Finja M. Muenchenberger, Stefan Dreiner, Holger Kappert, Holger Vogt
2019 15TH CONFERENCE ON PHD RESEARCH IN MICROELECTRONICS AND ELECTRONICS (PRIME)
(2019)
Proceedings Paper
Engineering, Electrical & Electronic
Semih Tuerk, Erik Verheyen, Reinhard Viga, Sonja Allani, Andreas Jupe, Holger Vogt
2018 14TH CONFERENCE ON PHD RESEARCH IN MICROELECTRONICS AND ELECTRONICS (PRIME 2018)
(2018)
Proceedings Paper
Chemistry, Applied
A. Jupe, P. Livshits, S. Kahnert, M. Figge, S. Mross, M. Goertz, H. Kappert, H. Vogt, A. Goehlich
NANOSTRUCTURED MATERIALS FOR THE DETECTION OF CBRN
(2018)
Proceedings Paper
Nanoscience & Nanotechnology
O. Dogan, A. Buschhausen, C. Walk, W. Mokwa, H. Vogt
INTERNATIONAL CONFERENCE ON NANOMATERIALS AND BIOMATERIALS (ICNB 2017)
(2018)
Proceedings Paper
Engineering, Electrical & Electronic
Dirk Weiler, Frank Hochschulz, Claudia Busch, Matthias Stein, Marvin D. Michel, Andreas Kuhl, Renee Lerch, Martin Petermann, Thomas Geruschke, Sebastian Blaeser, Sascha Weyers, Holger Vogt
ELECTRO-OPTICAL AND INFRARED SYSTEMS: TECHNOLOGY AND APPLICATIONS XV
(2018)
Proceedings Paper
Optics
Dirk Weiler, Frank Hochschulz, Claudia Busch, Matthias Stein, Marvin D. Michel, Daniel Wurfel, Renee Lerch, Martin Petermann, Thomas Geruschke, Sebastian Blaeser, Sascha Weyers, Holger Vogt
INFRARED TECHNOLOGY AND APPLICATIONS XLIV
(2018)
Article
Engineering, Electrical & Electronic
Erik Verheyen, Andreas Erbsloeh, Reinhard Viga, Holger Vogt
IEEE SENSORS LETTERS
(2018)