On the Way to Zero Defect of Plastic-Encapsulated Electronic Power Devices—Part II: Molding Compound

出版年份 2009 全文链接

标题

作者

关键词

出版物

Volume 9, Issue 2, Pages 279-287

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2009-03-21

DOI

10.1109/tdmr.2009.2018655

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