Influence of System Integration and Packaging on Its Inductive Power Link for an Integrated Wireless Neural Interface

出版年份 2009 全文链接

标题

作者

关键词

出版物

Volume 56, Issue 12, Pages 2927-2936

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2009-08-21

DOI

10.1109/tbme.2009.2028614

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