期刊
IEEE TRANSACTIONS ON BIOMEDICAL CIRCUITS AND SYSTEMS
卷 8, 期 6, 页码 810-823出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TBCAS.2014.2385061
关键词
Analog front-end (AFE); configurable discrete wavelet transform (DWT); low-power ADC; neural sensing microsystem; on-interposer bus; through-silicon-via (TSV); 2.5D heterogeneous integration; mu-probes
资金
- Ministry of Science and Technology [MOST 102-2220-E-009-062, MOST 103-2221-E-009-202-MY3]
- NPIE, Taiwan, R.O.C.
- Aim for the Top University Program of the National Chiao Tung University
- Ministry of Education, Taiwan, R.O.C.
- UST-UCSD International Center of Excellence in Advanced Bioengineering - Taiwan National Science Council I-RiCE Program [NSC-101-2911-I-009-101]
Heterogeneously integrated and miniaturized neural sensing microsystems are crucial for brain function investigation. In this paper, a 2.5D heterogeneously integrated bio-sensing microsystem with mu-probes and embedded through-silicon-via (TSVs) is presented for high-density neural sensing applications. This microsystem is composed of mu-probes with embedded TSVs, 4 dies and a silicon interposer. For capturing 16-channel neural signals, a 24 x 24 mu-probe array with embedded TSVs is fabricated on a 5 x 5 mm2 chip and bonded on the back side of the interposer. Thus, each channel contains 6 x 6 mu-probes with embedded TSVs. Additionally, the 4 dies are bonded on the front side of the interposer and designed for biopotential acquisition, feature extraction and classification via low-power analog front-end (AFE) circuits, area-power-efficient analog-to-digital converters (ADCs), configurable discrete wavelet transforms (DWTs), filters, and a MCU. An on-interposer bus (mu-SPI) is designed for transferring data on the interposer. Finally, the successful in-vivo test demonstrated the proposed 2.5D heterogeneously integrated bio-sensing microsystem. The overall power of this microsystem is only 676.3 mu W for 16-channel neural sensing.
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