A Review of Haptic Feedback Teleoperation Systems for Micromanipulation and Microassembly

出版年份 2013 全文链接

标题

作者

关键词

出版物

Volume 10, Issue 3, Pages 496-502

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2013-03-09

DOI

10.1109/tase.2013.2245122

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started