4.4 Article

HTS Pancake Coils Without Turn-to-Turn Insulation

期刊

IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
卷 21, 期 3, 页码 1592-1595

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TASC.2010.2093492

关键词

HTS pancake coils; mechanical integrity; no-insulation winding; thermal stability; turn-to-turn-insulation

资金

  1. National Center for Research Resources
  2. National Institute of Biomedical Imaging and Bioengineering
  3. National Institute of General Medical Sciences, NIH

向作者/读者索取更多资源

This paper reports a study of HTS pancake coils without turn-to-turn insulation. Three no-insulation (NI) pancake coils were wound: each single and double pancake coil of Bi2223 conductor and one single pancake of ReBCO conductor. An equivalent electrical circuit for modeling NI coils was verified by two sets of test: 1) charge-discharge; and 2) sudden discharge. Also, an overcurrent test in which a current exceeding a coil's critical current by 2.3 times was performed, and analysed, to demonstrate that in terms of stability NI HTS coils outperform their counterparts. The new NI winding offers HTS coils enhanced performance in three key parameters: overall current density; thermal stability; and mechanical integrity.

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