期刊
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
卷 21, 期 3, 页码 1592-1595出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TASC.2010.2093492
关键词
HTS pancake coils; mechanical integrity; no-insulation winding; thermal stability; turn-to-turn-insulation
资金
- National Center for Research Resources
- National Institute of Biomedical Imaging and Bioengineering
- National Institute of General Medical Sciences, NIH
This paper reports a study of HTS pancake coils without turn-to-turn insulation. Three no-insulation (NI) pancake coils were wound: each single and double pancake coil of Bi2223 conductor and one single pancake of ReBCO conductor. An equivalent electrical circuit for modeling NI coils was verified by two sets of test: 1) charge-discharge; and 2) sudden discharge. Also, an overcurrent test in which a current exceeding a coil's critical current by 2.3 times was performed, and analysed, to demonstrate that in terms of stability NI HTS coils outperform their counterparts. The new NI winding offers HTS coils enhanced performance in three key parameters: overall current density; thermal stability; and mechanical integrity.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据