Novel Isotropical Conductive Adhesives for Electronic Packaging Application

出版年份 2009 全文链接

标题

作者

关键词

出版物

Volume 32, Issue 3, Pages 589-592

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2009-05-27

DOI

10.1109/tadvp.2009.2018141

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