Performance Comparison Between Metallic Carbon Nanotube and Copper Nano-Interconnects

标题
Performance Comparison Between Metallic Carbon Nanotube and Copper Nano-Interconnects
作者
关键词
-
出版物
IEEE TRANSACTIONS ON ADVANCED PACKAGING
Volume 31, Issue 4, Pages 692-699
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2008-12-10
DOI
10.1109/tadvp.2008.2005001

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