One-Component, Low-Temperature, and Fast Cure Epoxy Encapsulant With High Refractive Index for LED Applications

出版年份 2008 全文链接

标题

作者

关键词

出版物

Volume 31, Issue 3, Pages 484-489

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2008-08-05

DOI

10.1109/tadvp.2008.924233

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