期刊
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
卷 22, 期 12, 页码 660-662出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LMWC.2012.2227141
关键词
Flexible substrates; green electronics; microwave circuits; paper substrates; transmission lines
资金
- ARTEMOS project [call 3 2010]
In this work, a new technique to fabricate microwave circuits in paper substrates is proposed. This technique relies on a copper adhesive tape that is shaped by a photo-lithographic process and then transferred to the hosting substrate by means of a sacrificial layer. Microstrip lines in paper substrates have been electromagnetically characterized accounting also for the adhesive layers. Experimental results show an insertion loss better than 0.6 dB/cm at 10 GHz.
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