A 6-Gb/s Wireless Inter-Chip Data Link Using 43-GHz Transceivers and Bond-Wire Antennas

标题
A 6-Gb/s Wireless Inter-Chip Data Link Using 43-GHz Transceivers and Bond-Wire Antennas
作者
关键词
-
出版物
IEEE JOURNAL OF SOLID-STATE CIRCUITS
Volume 44, Issue 10, Pages 2711-2721
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2009-09-26
DOI
10.1109/jssc.2009.2027932

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