Article
Engineering, Electrical & Electronic
Thorsten Oeder, Martin Pfost
Summary: This study investigates the threshold voltage (V-th) instability of p-gate GaN HEMTs induced by gate bias. Different effects are observed for devices with ohmic gate and Schottky gate, causing different variations in V-th. Electron depletion and trapping, as well as hole accumulation and trapping, are identified as the main causes of this instability.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2021)
Article
Engineering, Electrical & Electronic
Han Xu, Jin Wei, Ruiliang Xie, Zheyang Zheng, Jiabei He, Kevin J. Chen
Summary: Research has shown that the threshold voltage (V-TH) of enhancement-mode Schottky-type p-GaN gate HEMTs is dependent on the drain bias, requiring higher gate voltage to switch on the transistor due to the influence of stored charges in the floating p-GaN layer. A proposed SPICE-compatible equivalent circuit model accurately predicts the dynamic V-TH characteristics and switching behaviors of power electronics circuits, showcasing its advantages in power transistor applications.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2021)
Article
Engineering, Electrical & Electronic
Kailun Zhong, Han Xu, Zheyang Zheng, Junting Chen, Kevin J. Chen
Summary: The study investigates the dynamics of the intrinsic threshold voltage (V-TH) shift in 650V Schottky-type p-GaN gate HEMT under high-frequency switching. The results show that a higher V-DSQ leads to a larger dynamic V-TH shift (Delta V-TH), and Delta V-TH exhibits a gradually increasing trend under continuous high-frequency switching. Additionally, after continuous switching operation for 200 microseconds, the maximum Delta V-TH shows no dependence on the switching frequency.
IEEE ELECTRON DEVICE LETTERS
(2021)
Article
Engineering, Electrical & Electronic
Injun Hwang, Jaejoon Oh, Sun-Kyu Hwang, Boram Kim, Jun Hyuk Park, Joonyong Kim, Jongseob Kim
Summary: This study analyzes the threshold voltage drift of p-GaN gate high-electron mobility transistor (HEMT) under high-voltage and hard switching conditions. A method is proposed to accurately measure the dynamic threshold voltage by correcting the charging current of the internal drain capacitance. The experimental results show that the dynamic threshold voltage rapidly increases and saturates during the switching operation, and it has a linear relationship with the gate turn-on voltage.
IEEE ELECTRON DEVICE LETTERS
(2022)
Article
Engineering, Electrical & Electronic
Xin Zhou, Zhao Wang, Zhonghua Wu, Qi Zhou, Ming Qiao, Zhaoji Li, Bo Zhang
Summary: This article studies the total-ionizing-dose (TID) response for dynamic threshold voltage (V-TH) in p-GaN gate high electron mobility transistors (HEMTs). A nonmonotonic dependence of V-TH on dynamic gate stress is observed and the impact mechanism of irradiation damages in the metal/p-GaN/AlGaN system is revealed. The nonmonotonic V-TH shift is caused by the change in the competition relationship between electron trapping and hole-injection due to irradiation damages, which is verified by the increase in gate current, drain leakage, and change in gate capacitance.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2023)
Article
Engineering, Electrical & Electronic
Cong Zhang, Ruohe Yao
Summary: In this paper, we analyze the threshold voltage shift mechanism of p-GaN HEMT connected with Schottky diode and PIN diode under the influence of gate voltage. The carrier transport mechanism and the gate current model and threshold voltage shift model of the p-GaN HEMT are discussed. The effects of p-GaN doping concentration, AlGaN barrier layer thickness, and Al component on the gate current and VTH shift are discussed based on the model. By optimizing the device structure and process parameters, the gate current of HEMT can be reduced and the stability of VTH can be improved.
MICROELECTRONICS RELIABILITY
(2023)
Article
Engineering, Electrical & Electronic
L. Ghizzo, D. Tremouilles, F. Richardeau, S. Vinnac, L. Moreau, N. Mauran
Summary: In reliability studies, the instability of threshold voltage (Vth) is a problem that can blur the drift due to device aging. New methods are needed to overcome the trapping-related instability to accurately monitor aging. A preconditioning step before Vth measurement on GaN transistors was studied, which led to a stable and repeatable value of Vth. The role of hole injection in the structure was identified through analysis, and the preconditioned-Vth measurement method was proposed for future reliability studies.
MICROELECTRONICS RELIABILITY
(2023)
Article
Engineering, Electrical & Electronic
Yitian Gu, Wei Huang, Yu Zhang, Jin Sui, Yangqian Wang, Haowen Guo, Jianjun Zhou, Baile Chen, Xinbo Zou
Summary: The temperature-dependent dc and dynamic characteristics of p-GaN gate HEMT were investigated, and it was found that the drain current improved at low temperature. The mechanisms of threshold voltage shift were analyzed, and the activation energies for hole emission and trapping processes were obtained. The detailed study of temperature-reliant dynamic performance provides useful information for low-temperature applications and device optimizations of p-GaN gate HEMT.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2022)
Article
Engineering, Electrical & Electronic
Jialin Li, Yian Yin, Fengbo Liao, Mengxiao Lian, Xichen Zhang, Keming Zhang, Yafang Xie, You Wu, Bingzhi Zou, Zhixiang Zhang, Jingbo Li
Summary: This article proposes the use of a stepped channel to increase the threshold voltage(Vth) for the first time. Its working mechanism is explained and the step height is optimized. By introducing a composite stepped gate and p-GaN buried layer with field plate, the threshold voltage can be as high as 3.5V and the breakdown voltage can reach 2440V with a high figure of merit (FOM) of 2.57GW/cm2. The composite stepped gate GaN-based HEMT shows great potential in high-power devices and has advantages in communication system applications.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2023)
Article
Engineering, Electrical & Electronic
Zuoheng Jiang, Mengyuan Hua, Xinran Huang, Lingling Li, Chengcai Wang, Junting Chen, Kevin J. Chen
Summary: In this article, the impacts of off-state gate bias on the dynamic on-resistance in p-GaN Gate high-electron-mobility transistors are investigated. It is found that more negative off-state gate bias can worsen the degradation of dynamic on-resistance, especially when switching with a high drain bias. The influences of off-state gate bias on switching transients and off-state stress are explored to reveal the underlying mechanisms.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2022)
Article
Physics, Applied
Ethan S. Lee, Jungwoo Joh, Dong Seup Lee, Jesus A. del Alamo
Summary: In this study, the impact of gate geometry on forward operation of Schottky-gate p-GaN high electron mobility transistors (HEMTs) was experimentally investigated. The results showed that gate geometry affected the threshold voltage and subthreshold swing scaling, but had a classical scaling effect on peak transconductance and ON resistance. Additionally, the relative areas of two junctions in Schottky-type p-GaN gate HEMTs were found to be an additional design degree of freedom to fine-tune device performance.
APPLIED PHYSICS LETTERS
(2022)
Article
Physics, Applied
Xiaohu Wang, Xuefeng Zheng, Baocai Wang, Yingzhe Wang, Shaozhong Yue, Tian Zhu, Wei Mao, Hao Zhang, Xiaohua Ma, Yue Hao
Summary: This Letter investigates the threshold voltage instability of p-GaN gate AlGaN/GaN HEMTs under high-temperature reverse bias stress. The experimental results show that the threshold voltage increases by 0.62 V after 100 ks stress at 200 degrees C, and the degradation phenomenon is unrecoverable. The defect evolution process during the stress is characterized using deep-level transient spectroscopy (DLTS) technique. Two kinds of electron traps within the p-GaN layer are proposed to explain the degradation, which are generated by the injected high-energy electrons from the gate electrode.
APPLIED PHYSICS LETTERS
(2023)
Article
Engineering, Electrical & Electronic
Chao-Ching Chiang, Hsiao-Hsuan Wan, Jian-Sian Li, Fan Ren, Timothy Jinsoo Yoo, Honggyu Kim, S. J. Pearton
Summary: Sputtered p-NiO films were used to suppress gate leakage and produce a positive shift in the gate voltage of AlGaN/GaN high-electron mobility transistors for e-mode operation. The utility of NiO gates in increasing the on-off ratio and shifting the threshold voltage in comparison to Schottky gates was demonstrated.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
(2023)
Article
Energy & Fuels
Alessandro Borghese, Alessandro Di Costanzo, Michele Riccio, Luca Maresca, Giovanni Breglio, Andrea Irace
Summary: This work presents a comparison of gate-driving requirements for p-GaN HEMTs with Schottky and Ohmic gate contacts, and experimentally verifies the presence of gate current in both device types. It proposes using gate current as a temperature-sensitive parameter and examines the feasibility of monitoring gate current during real circuit operation without adding complexity to the gate driver, through experimental measurements on commercially available p-GaN HEMTs.
Article
Engineering, Electrical & Electronic
Yidi Yin, Kean Boon Lee
Summary: This research presents an enhancement-mode p-channel GaN heterojunction field effect transistor with a metal-insulator-semiconductor gate structure, achieving excellent performance through various treatments.
IEEE ELECTRON DEVICE LETTERS
(2022)