4.6 Article

Power Performance of AlGaN/GaN High-Electron-Mobility Transistors on (110) Silicon Substrate at 40 GHz

期刊

IEEE ELECTRON DEVICE LETTERS
卷 34, 期 4, 页码 490-492

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IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2013.2244841

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AlGaN/GaN; high-electron-mobility transistor (HEMT); millimeter-wave power density; Si (110)

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This letter reports the first millimeter-wave power demonstration of AlGaN/GaN high-electron-mobility transistors grown on a (110) silicon substrate. Owing to an AlN/AlGaN stress-mitigating stack and in spite of the twofold surface symmetry of Si (110), it is possible to obtain crack-free GaN layers for the fabrication of millimeter-wave power devices with high performance. The device exhibits a maximum dc drain current density of 1.55 A/mm at V-GS = 0 V with an extrinsic transconductance of 476 mS/mm. An extrinsic current gain cutoff frequency of 81 GHz and a maximum oscillation frequency of 106 GHz are deduced from S-ij parameters. At 40 GHz, an output power density of 3.3 W/mm associated with a power-added efficiency of 20.1% and a linear power gain of 10.6 dB is obtained.

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