Article
Engineering, Electrical & Electronic
Francis Wolff, Daniel Weyer, Chris Papachristou, Steve Clay
Summary: With the reduction of device geometries, consideration for semiconductor aging and product lifetimes becomes more significant. Designers now need to think about lifetime tradeoffs early in the design cycle, rather than pushing it to the end of the process.
MICROELECTRONICS RELIABILITY
(2021)
Article
Materials Science, Multidisciplinary
Peng Sun, Jinbao Zhang, Xiaoyang Zhu, Hongke Li, Yang Li, Jianjun Yang, Zilong Peng, Guangming Zhang, Fei Wang, Hongbo Lan
Summary: This study proposed a direct ink writing 3D printing method for manufacturing multilayer stretchable electronic devices, which achieved stable and repeatable manufacturing by using specific materials and parameters, reducing stress concentration and achieving stable electrical response of the devices.
ADVANCED MATERIALS TECHNOLOGIES
(2022)
Article
Chemistry, Physical
Tingwei Gao, Chunhui He, Chenguang Liu, Yinqi Fan, Cezhou Zhao, Chun Zhao, Weitao Su, Yannick J. Dappe, Li Yang
Summary: The use of graphene as a new type of electrode at molecular junctions has led to enhanced conductance for longer molecules. Studies involving oligopthiophene based hybrid gold-graphene junctions show similar behavior to alkane-based junctions, as supported by experiments and DFT calculations.
PHYSICAL CHEMISTRY CHEMICAL PHYSICS
(2021)
Review
Materials Science, Multidisciplinary
H. Ceric, S. Selberherr, H. Zahedmanesh, R. L. de Orio, K. Croes
Summary: This study introduces a novel concept for modeling nano-interconnect structures, exploring the impact of grain boundaries and grain distribution on interconnect reliability. Additionally, a simple and numerically efficient approach for simulating void growth and its influence on interconnect resistivity is proposed and compared to experimental results. The simulations based on the novel modeling concept predict a reduction in interconnect lifetime with increased temperature and reduced linewidth, consistent with experimental observations.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2021)
Article
Nanoscience & Nanotechnology
Boyu Liu, Yongli Yu, Zhennan Hu, Mengke Li, Liuhong Ma, Haibin Sun, Jianxin Jia, Changhui Jiang, Yinghui Zhong, Yuwei Chen, Zhiyong Duan
Summary: Nanoimprint technology offers the advantages of low cost, high precision, high fidelity, and high yield. This paper presents the use of metal nanoparticle fluid as an imprint transfer medium and the completion of thermal diffusion process through microwave sintering, resulting in metal interconnect wires with fewer grain boundaries and holes and excellent mechanical and electronic properties.
Article
Chemistry, Physical
Farzin Najafi, Guorui Wang, Teng Cui, Abu Anand, Sankha Mukherjee, Tobin Filleter, Mohini Sain, Chandra Veer Singh
Summary: Through atomistic simulations and experiments, the fatigue response of graphene oxide (GO) was studied, highlighting the significant impact of functionalization degree and ratio on the fatigue resistance of GO. GO with low functionalization degree exhibited higher fatigue life, while epoxy-rich GO showed enhanced fatigue resistance.
Article
Physics, Applied
Shun Nakajima, Yoko Wasai, Kenji Kawahara, Nataliya Nabatova-Gabain, Ploybussara Gomasang, Hiroki Ago, Hiroyuki Akinaga, Kazuyoshi Ueno
Summary: The reliability of graphene-capped copper (Gr/Cu) against humidity was assessed using spectroscopic ellipsometry (SE). It was found that tri-layer graphene (TLG) has higher moisture resistance than single-layer graphene (SLG), with less change in the crystalline Gr volume fraction and thickness. This leads to a reduction in Cu-oxide thickness and improved uniformity under the Gr cap.
JAPANESE JOURNAL OF APPLIED PHYSICS
(2023)
Article
Engineering, Electrical & Electronic
Jianfeng Yang, Jing Chen, Yujia Huo, Yanyu Liu
Summary: This paper introduces a novel reliability model for cluster-based wireless sensor network system using masked data, with the expectation maximization algorithm employed for maximum likelihood estimation. The model assumes that a WSN consists of multiple independent clusters, and evaluates system reliability based on the topology of the system.
JOURNAL OF SENSORS
(2021)
Review
Computer Science, Information Systems
Jan Mach, Lukas Kohutka, Pavel Cicak
Summary: This paper discusses the importance of protecting on-chip bus interconnects and reviews existing protection approaches used in processors for mission and safety-critical applications. The protection approaches are categorized into three groups: information, temporal, and spatial redundancy, and compared based on their fundamental properties.
Article
Materials Science, Multidisciplinary
Ke Wang, M. E. Raikh, T. A. Sedrakyan
Summary: The presence of a weak perpendicular magnetic field in graphene breaks the chiral symmetry of each valley in the electron spectrum, leading to anomalous dependencies in the electron-electron interaction lifetime and magnetic field corrections to the thermodynamic characteristics. Experiments are discussed to explore the effects predicted by this symmetry breaking.
Article
Engineering, Civil
Le Li, Mojtaba Mahmoodian, Alireza Khaloo
Summary: This paper proposes an innovative method to determine the service life of worn contact wires, and provides a mathematical model and probabilistic analysis to help engineers and asset managers make optimal decisions.
STRUCTURE AND INFRASTRUCTURE ENGINEERING
(2023)
Article
Chemistry, Multidisciplinary
Yinqi Fan, Shuhui Tao, Sylvain Pitie, Chenguang Liu, Chun Zhao, Mahamadou Seydou, Yannick J. Dappe, Paul J. Low, Richard J. Nichols, Li Yang
Summary: This article discusses the significance of quantum interference on molecular conductance and elucidates the impact of different electrode materials and anchor groups on molecular conductance.
Article
Materials Science, Multidisciplinary
Cassandra Moers, Christian Dresbach, Holm Altenbach
Summary: This article presents two calibrated and validated fatigue lifetime models for describing the lifetime of aluminum bonding wires. The nonlinear model shows excellent agreement with experimental results over the entire cycle range and can be implemented for other wire types.
Article
Chemistry, Physical
Min Hee Jeong, Hokyun Rho, Mina Park, Dong Yeong Kim, Hyunjung Lee, Tae-Wook Kim, Sukang Bae, Sang Hyun Lee
Summary: This study investigates the effect of underlying graphene layers on the electrical properties of Cu interconnects. It is found that increasing the width of the graphene layer improves the current capacity of the Cu interconnect and prevents sudden current drop due to breakage. The results highlight the importance of effective heat dissipation for achieving high-performance interconnects.
APPLIED SURFACE SCIENCE
(2022)
Article
Engineering, Aerospace
Yingshi Hu, Zhenzhou Lu, Ning Wei, Xia Jiang, Changcong Zhou
Summary: This paper proposes a Kriging surrogate model based method to estimate the safety lifetime of Multi-mode Time-Dependent Structural System (MTDSS). The method utilizes extremum learning function, Advanced First Failure Instant Learning Function (AFFILF), and Candidate Sample Pool (CSP) reduction strategy to accurately and efficiently search for the safety lifetime.
CHINESE JOURNAL OF AERONAUTICS
(2022)
Article
Chemistry, Multidisciplinary
Hyun-Cheol Kim, Hakseong Kim, Jae-Ung Lee, Han-Byeol Lee, Doo-Hua Choi, Jun-Ho Lee, Wi Hyoung Lee, Sung Ho Jhang, Bae Ho Park, Hyeonsik Cheong, Sang-Wook Lee, Hyun-Jong Chung
Article
Chemistry, Physical
Duk Hyun Lee, Cheol Kyeom Kim, Jun-Ho Lee, Hyun-Jong Chung, Bae Ho Park
Article
Engineering, Electrical & Electronic
Young Gon Lee, Sung Kwan Lim, Chang Goo Kang, Yun Ji Kim, Doo Hua Choi, Hyun-Jong Chung, Rino Choi, Byoung Hun Lee
MICROELECTRONIC ENGINEERING
(2016)
Article
Materials Science, Multidisciplinary
Jaehong Lee, Jaeho Lee, David H. Seo, Hyungcheol Shin, Seongjun Park, Hyun-Jong Chung
CURRENT APPLIED PHYSICS
(2014)
Article
Chemistry, Multidisciplinary
Kyung-Eun Byun, Hyun-Jong Chung, Jaeho Lee, Heejun Yang, Hyun Jae Song, Jinseong Heo, David H. Seo, Seongjun Park, Sung Woo Hwang, InKyeong Yoo, Kinam Kim
Article
Chemistry, Multidisciplinary
Jinseong Heo, Kyung-Eun Byun, Jaeho Lee, Hyun-Jong Chung, Sanghun Jeon, Seongjun Park, Sungwoo Hwang
Article
Chemistry, Physical
Jaeho Lee, Hyun-Jong Chung, David H. Seo, Jaehong Lee, Hyungcheol Shin, Sunae Seo, Seongjun Park, Sungwoo Hwang, Kinam Kim
Article
Nanoscience & Nanotechnology
Eunji Kim, Kyung-Eun Byun, Dong Shin Choi, Dong Jun Lee, Duck Hyung Cho, Byung Yang Lee, Heejun Yang, Jinseong Heo, Hyun-Jong Chung, Sunae Seo, Seunghun Hong
Article
Multidisciplinary Sciences
Gwangwoo Kim, Sung-Soo Kim, Jonghyuk Jeon, Seong In Yoon, Seokmo Hong, Young Jin Cho, Abhishek Misra, Servet Ozdemir, Jun Yin, Davit Ghazaryan, Mathew Holwill, Artem Mishchenko, Daria V. Andreeva, Yong-Jin Kim, Hu Young Jeong, A-Rang Jang, Hyun-Jong Chung, Andre K. Geim, Kostya S. Novoselov, Byeong-Hyeok Sohn, Hyeon Suk Shin
NATURE COMMUNICATIONS
(2019)
Article
Nanoscience & Nanotechnology
Do-Hyun Park, Young Jin Cho, Jun-Ho Lee, Inchul Choi, Sung Ho Jhang, Hyun-Jong Chung
Article
Materials Science, Multidisciplinary
Jun-Ho Lee, Han-Byeol Lee, Nae Bong Jeong, Do-Hyun Park, Inchul Choi, Hyun-Jong Chung
CURRENT APPLIED PHYSICS
(2020)
Article
Nanoscience & Nanotechnology
Seunghyun Kim, Do Hun Kwak, Inchul Choi, Jinhyun Hwang, Bitnuri Kwon, Eunho Lee, Jongpil Ye, Hyungsub Lim, Kilwon Cho, Hyun-Jong Chung, Wi Hyoung Lee
ACS APPLIED MATERIALS & INTERFACES
(2020)
Article
Multidisciplinary Sciences
Jun-Ho Lee, Dong Hoon Shin, Heejun Yang, Nae Bong Jeong, Do-Hyun Park, Kenji Watanabe, Takashi Taniguchi, Eunah Kim, Sang Wook Lee, Sung Ho Jhang, Bae Ho Park, Young Kuk, Hyun-Jong Chung
Summary: The study presents a semiconductor-less solid-state electronic device capable of industry-applicable switching of ballistic current by modulating the field emission barrier height across the graphene-hexagonal boron nitride interface. The device demonstrates adjustable intrinsic gain and unprecedented current stability, extending the potential of 2D van der Waals devices to applications in extreme environments.
NATURE COMMUNICATIONS
(2021)
Article
Nanoscience & Nanotechnology
Jihoon Jeon, Duk Hyun Lee, Yeon Soo Kim, Hyun-Jong Chung, Sung Ho Jhang, Yongkyung Kwon, Suyoun Lee, Bae Ho Park
ACS APPLIED MATERIALS & INTERFACES
(2020)
Article
Materials Science, Multidisciplinary
Doo-Hua Choi, Jun-Ho Lee, Hyun-Cheol Kim, Han-Byeol Lee, Nae Bong Jeoung, Do-Hyun Park, Hakseong Kim, Sung Ho Jhang, Sang-Wook Lee, Hyun-Jong Chung
CURRENT APPLIED PHYSICS
(2017)