Physics-Based Thermal Conductivity Model for Metallic Single-Walled Carbon Nanotube Interconnects

出版年份 2010 全文链接

标题

作者

关键词

出版物

Volume 32, Issue 2, Pages 203-205

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2010-12-22

DOI

10.1109/led.2010.2091491

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