Encapsulation for Flexible Electronic Devices

标题
Encapsulation for Flexible Electronic Devices
作者
关键词
-
出版物
IEEE ELECTRON DEVICE LETTERS
Volume 32, Issue 12, Pages 1743-1745
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2011-10-26
DOI
10.1109/led.2011.2168378

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