Thermomechanical modeling of 3D electronic packages

标题
Thermomechanical modeling of 3D electronic packages
作者
关键词
-
出版物
IBM JOURNAL OF RESEARCH AND DEVELOPMENT
Volume 52, Issue 6, Pages 623-634
出版商
IBM
发表日期
2010-04-06
DOI
10.1147/jrd.2008.5388568

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