aravindhan srinivasan 提问于 3周前

[IEEE Transactions on Components Packaging and Manufacturing Technology] - What are all the reasons for wirebonds deformations or disturbances inside the sealed and screening completed microelectronics?

This is regarding Hybrid Micro Circuits failure analysis, during our failure analysis, we cut open the microcircuit and found wire bond disturbance. What are all the reasons for wirebonds deformations or disturbances inside the hermitically sealed and screening completed microelectronics?