On the deformation mechanism of SiC under nano-scratching: an experimental investigation

作者

Yang He¹ , Jiahao Hu¹ , Zhen Li¹ , Liangchi Zhang¹

1. Southern University of Science and Technology

会议/活动

24th International Conference on Wear of Materials, April 2023 (Banff, Canada)

海报摘要

SiC is an important semiconductor but is difficult to machine due to its high hardness and low fracture toughness. The deformation mechanisms of SiC subjected to single-point cutting is so far unclear. This paper aims to clarify such mechanisms by carrying out experimental investigations at similar length and load scales to those based on molecular dynamics. To this end, nano-scratching tests were conducted on AFM. Diamond AFM tips of the radius of 10 nm and 60 nm were used as the single-point nano-scratching tool on the surfaces of 4H-SiC and 6H-SiC single crystals with oxide amorphous layer. The investigation revealed that the subsurface deformation was mainly caused by amorphous phase transformation. Dislocations were rarely found and no crack emerged. This study then identified that under nano-scratching, the main mechanism of material removal of a single crystalline SiC is via amorphous phase transformation.

关键词

SiC, Nanoscratching, Deformation mechanism, Subsurface analysis

研究领域

Nanoengineering, Mechanical Engineering, Material Sciences

参考文献

1. D. Nakamura, et al. Nature, 430 (2004)1009-1012.
2. Z. Wu, et al. Acta Mater., 182 (2020) 60-67.
3. Z. Wu, et al. J. Mater. Sci. Technol., 90 (2021) 58-65.

基金

1. National Natural Science Foundation of China Project (No. 52293401)
2. Shenzhen Key Laboratory of Cross-Scale Manufacturing Mechanics Project (No. ZDSYS20200810171201007)
3. Guangdong Specific Discipline Project (No. 2020ZDZX2006)
4. Shenzhen Science and Technology Program Project (No. RCBS20210706092216025)

补充材料

暂无数据

附加信息

利益冲突

No competing interests were disclosed.

数据可用性声明

The datasets generated during and / or analyzed during the current study are available elsewhere (e.g., repository).
www.sciencedirect.com/science/article/pii/S0043164823002545

知识共享许可协议

Copyright © 2023 He et al. This is an open access work distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.