COMPUTERS IN INDUSTRY

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COMPUT IND

ISSN / eISSN

0166-3615

目标和范围

The aim of Computers in Industry is to publish original, high-quality, application-oriented research papers that:

• Show new trends in and options for the use of Information and Communication Technology in industry;
• Link or integrate different technology fields in the broad area of computer applications for industry;
• Link or integrate different application areas of ICT in industry.

研究方向

计算机：跨学科应用

CiteScore

21.10

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CiteScore 学科排名

类别	分区	排名
Engineering - General Engineering	Q1	#2/302
Engineering - General Computer Science	Q1	#6/233

Web of Science 核心合集

Science Citation Index Expanded (SCIE)	Social Sciences Citation Index (SSCI)
Indexed	-

类别 (Journal Citation Reports 2023)	分区
COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS - SCIE	Q1

H-index

出版国家或地区

NETHERLANDS

出版商

Elsevier

出版周期

Bimonthly

年文章数

161

Open Access

通讯方式

ELSEVIER SCIENCE BV, PO BOX 211, AMSTERDAM, NETHERLANDS, 1000 AE

同领域相关热门期刊
近期发表文章

A Metamodel for Designing Assessment Models to support transition of production systems towards Industry 5.0: (2023) Mariateresa Caggiano, Concetta Semeraro, Michele Dassisti

OpenTwins: An open-source framework for the development of next-gen compositional digital twins: (2023) Julia Robles, Cristian Martín, Manuel Díaz

Emergence of collective intelligence in industrial cyber-physical-social systems for collaborative task allocation and defect detection: (2023) Inno Lorren Désir Makanda, Pingyu Jiang, Maolin Yang, Haoliang Shi

Uncertainty-aware and dynamically-mixed pseudo-labels for semi-supervised defect segmentation: (2023) Dejene M. Sime, Guotai Wang, Zhi Zeng, Bei Peng

Automatic definition of engineer archetypes: A text mining approach: (2023) Francesco Lupi, Mohammed M. Mabkhot, Eleonora Boffa, Pedro Ferreira, Dario Antonelli, Antonio Maffei, Niels Lohse, Michele Lanzetta

Development of taxonomy for classifying defect patterns on wafer bin map using Bin2Vec and clustering methods: (2023) Dong-Hee Lee, Eun-Su Kim, Seung-Hyun Choi, Young-Mok Bae, Jong-Bum Park, Young-Chan Oh, Kwang-Jae Kim

A two-stage unsupervised approach for surface anomaly detection in wire and arc additive manufacturing: (2023) Hao Song, Chenxi Li, Youheng Fu, Runsheng Li, Haiou Zhang, Guilan Wang

Question answering models for human–machine interaction in the manufacturing industry: (2023) Eneko Ruiz, María Inés Torres, Arantza del Pozo

Neuro-symbolic model for cantilever beams damage detection: (2023) Darian M. Onchis, Gilbert-Rainer Gillich, Eduard Hogea, Cristian Tufisi

Reinforcement learning for disassembly sequence planning optimization: (2023) Amal Allagui, Imen Belhadj, Régis Plateaux, Moncef Hammadi, Olivia Penas, Nizar Aifaoui

认证评论

注：认证评论选取于全球各个学术评论平台和社交媒体。

I was rejected after three days of submission, and the response stated: "This study focuses on software security: it is best to submit it to a journal that specializes in this topic, rather than a multidisciplinary journal like CII. These references have not been published in journals." The speed of the review is really fast. Previously, I saw someone in the comments saying they were rejected in three days, and it seems that Letpub's comments are indeed trustworthy!

2022-05-28

Share the progress of submission:
2022/06/24: Submitted;
2022/08/02: Major revision;
2022/11/03: Submitted the revised manuscript;
2022/11/22: Minor revision;
2022/11/30: Submitted the revised manuscript;
2022/12/01: Accepted.
The editor was very responsible, and each round of processing was very quick. The journal's impact factor is also high, and it is expected to be in the top tier this year. A very good submission experience.

2022-12-04

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