IEEE TRANSACTIONS ON MOBILE COMPUTING

期刊名
IEEE TRANSACTIONS ON MOBILE COMPUTING

IEEE T MOBILE COMPUT

ISSN / eISSN
1536-1233 / 1558-0660
目标和范围
IEEE Transactions on Mobile Computing focuses on the key technical issues related to (a) architectures, (b) support services, (c) algorithm/protocol design and analysis, (d) mobile environments, (e) mobile communication systems, (f) applications, and (g) emerging technologies. Topics of interest include, but are not limited to, the following: a) Architectures - Mobile networks and hosts, Agents and proxies, Mobility management, mobile agent and proxy architectures Integrated wireline and wireless systems, Planning and standardization. b) Support Services - Mobility and roaming, Nomadic computing, Multimedia Operating system support, Power management. c) Algorithm/Protocol Design and Analysis - Online and mobile environments, Limited bandwidth, Intermittent connectivity. d) Mobile Environments - Data and knowledge management, Performance modeling and characterization, Security, scalability and reliability, Design, management and operation, Systems and technologies. e) Mobile Communication Systems - Wireless, cellular and spread-spectrum systems, Multi-user and multi-access techniques and algorithms, Multi-channel processing, Channel coding, Data coding and compression. f) Applications - Location-dependent and sensitive, Nomadic computing, Wearable computers and body area networks, Multimedia applications and multimedia signal processing, Pervasive computing, Wireless sensor networks. g) Emerging Technologies.
研究方向

计算机:信息系统

电信学

CiteScore
13.10 查看趋势图
CiteScore 学科排名
类别 分区 排名
Computer Science - Computer Networks and Communications Q1 #18/379
Computer Science - Electrical and Electronic Engineering Q1 #39/738
Computer Science - Software Q1 #33/404
Web of Science 核心合集
Science Citation Index Expanded (SCIE) Social Sciences Citation Index (SSCI)
Indexed -
类别 (Journal Citation Reports 2023) 分区
COMPUTER SCIENCE, INFORMATION SYSTEMS - SCIE Q1
TELECOMMUNICATIONS - SCIE Q1
H-index
122
出版国家或地区
UNITED STATES
出版商
Institute of Electrical and Electronics Engineers Inc.
出版周期
Monthly
出版年份
2002
年文章数
319
Open Access
NO
通讯方式
IEEE COMPUTER SOC, 10662 LOS VAQUEROS CIRCLE, PO BOX 3014, LOS ALAMITOS, USA, CA, 90720-1314
认证评论
注: 认证评论选取于全球各个学术评论平台和社交媒体。
TMC received a revise and resubmit decision in the first review, with a total of three opinions - two for resubmission and one for major revision. All of them raised various doubts. After making careful modifications for a month and a half, it was resubmitted. Two and a half months later, a major revision request was received, resulting in one resubmission, one major revision, and one minor revision. After focusing on the modifications requested for resubmission and replying, the acceptance was received over two months later. The expertise of the journal reviewers is quite high. It was the first time encountering such professional and meticulous reviewers, which required researching a lot of information and spending almost as much time as writing the paper. In conclusion, as long as we make targeted modifications and provide sufficient reasons for areas that cannot be changed, there is great hope. Even if it is rejected, we can submit to another journal without any problem.
2021-02-01
I don't know how to reply to people... Just say it here. I made up my own words for this publication... It's about ten to twenty articles per month. Maybe there are a lot of manuscripts, so the editor's speed is slow. After urging for the manuscript, they replied in a few days. I feel like the reviewers are quite diverse, doing various things. The reviewers for my batch are all traditional and ask typical questions in their reviews, like changing the introduction and adding comparisons. There were four reviewers, three suggesting major revisions and one suggesting resubmission. The editor gave it a major revision. It's contradictory to suggest resubmission and then give a "good" score in the paper evaluation. The questions were also too easy, so I guess the reviewer is not specialized in this area.
2023-03-06

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